Sign In | Join Free | My isp.org.cn
China Bicheng Electronics Technology Co., Ltd logo
Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
Verified Supplier

6 Years
Home > Impedance Controlled PCB >

High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

Product Categories
Bicheng Electronics Technology Co., Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold

Brand Name : Bicheng

Model Number : BIC-477.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : FR-4

Layer count : 6 Layers

PCB thickness : 1.6mm ±0.16

PCB size : 54.99 x 87.50mm=1UP

Solder mask : Green

Silkscreen : White

Copper weight : 1oz

Surface finish : Immersion gold

Contact Now

Via in Pad PCB High Density Multilayer PCB Via Filled Circuit Board with Immersion Gold for GPS Tracking Devices
1.1 General description
This is a type of 6 layer printed circuit board built on FR-4 Tg170 substrate for the application of GPS Tracking Devices. It's 1.6 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supplying 1 up single board. Vias with 0.3mm are resin filled and plated flatly (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
1.2 Features and benifits
RoHS compliant and suitable for high thermal reliability needs
Excellent surface planarity for CSP mounted components to reduce failure rate during assembly and soldering.
Reliability test, insulation resistance test and ionic contamination test
16000 square meter workshop
12 hours quotation
No quality complaint is meant to save money
High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold
1.3 Applications
Inverters
Router ADSL
Industrial Computer
Weather analysis
1.4 Parameter and data sheet
Number of Layers 6
Board Type Multi-layer PCB
Board size 54.99 x 87.50mm=1UP
Board Thickness 1.6mm +/-0.16
Board Material FR-4
Board Material Supplier ITEQ
Tg Value of Board Material 170℃
PTH Cu thickness ≥20 um (See hole wall details)
Inner Iayer Cu thicknes 35 um (1oz)
Surface Cu thickness 35 um (1oz)
Solder Mask Type and Model No. LPSM, PSR-2000GT600D
Solder Mask Supplier TAiYO
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 13um
Type of Silkscreen Ink TAIYO, IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
Mininum Trace (mil) 7 mil
Minimum Gap(mil) 4.9 mil
Surface Finish Immersion Gold
RoHS Required Yes
Warpage 0.25%
Drill table (mm)
T1 1.000
T2 3.175
Thermal Shock Test Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm) T1: 0.600
T2: 0.700
T3:0.800
T4: 1.000
T5: 1.100
T6: 1.250
T7: 1.850
T8: 4.000
T9: 4.325
High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold
1.5 Design For Manufacture (1)
Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume (S<10 m²) Prototype(S<1m²)
1 Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.isolation of layers 0.1mm 0.1mm 0.06mm
2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
7 Min.distance from drill to conductor 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil 4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil
8 Min.width of annular ring on inner layer 4 Layer 10mil(35um),≥6 Layer 14mil(35um) 4 Layer 8mil(35um),≥6 layer 12mil(35um) 4 Layer 6mil(35um),≥6 Layer 10mil(35um)
9 Inner layer isolation ring width(Min) 10mil (35um) 8mil (35um) 6mil (35um)
10 Min.via pad diameter 20mil (35um) 16mil (35um) 16mil (35um)
11 Min. distance from board edge to conductor(no copper exposured)(inner layer) 14 mil(35um) 12 mil(35um)) 8 mil(35um)
12 Maximum copper weight(Inner layer and outer layer) 3 OZ( 105 um ) 4 OZ ( 140 um ) 6 OZ( 210 um )
13 Core with different copper foil on both sides / 18/35,35/70 um 18/35,35/70 um


Product Tags:

Immersion Gold Automotive Printed Circuit Board

      

FR4 Tg170 Automotive Printed Circuit Board

      

FR4 Tg170 High Density PCB

      
Cheap High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold wholesale

High Density FR4 Tg170 Automotive Printed Circuit Board With Immersion Gold Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Bicheng Electronics Technology Co., Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
You May Like