Introducing our newly shipped PCB based on DiClad 880, a cutting-edge substrate that harnesses the power of woven fiberglass and PTFE-based composites. Engineered by Rogers, a leader in advanced materials, the DiClad 880 PCB offers unparalleled performance, exceptional dielectric properties, and unmatched reliability for a wide range of applications.
Key Features & Benefits:
1. Impressive Dielectric Performance:
The DiClad 880 PCB boasts a low dielectric constant (DK) of 2.17 or 2.2 +/- 0.04 at 10 GHz/23°C and 1 MHz, ensuring optimal signal integrity and minimal loss. Its impressively low dissipation factor of 0.0009 at 10 GHz/23°C and 0.0008 at 1 MHz further enhances its efficiency.
2. Temperature Stability:
With a temperature coefficient of DK (TcDK) of -160 ppm/°C ranging from -10°C to 140°C, the DiClad 880 PCB maintains its exceptional performance even under extreme temperature conditions. Say goodbye to signal degradation and hello to reliability.
3. Moisture Resistance:
DiClad 880 features the lowest moisture absorption among PTFE-based composites, standing at a mere 0.02%. This exceptional moisture resistance ensures consistent performance and longevity, even in humid environments.
4. Dimensional Stability:
This PCB offers excellent dimensional stability, with a coefficient of thermal expansion (CTE) of 25 ppm/°C (X-axis), 34 ppm/°C (Y-axis), and 252 ppm/°C (Z-axis). This stability ensures precise and reliable connections, even with varying temperatures.
5. Wide Frequency Range:
Experience stable DK performance across a wide frequency range, making the DiClad 880 PCB suitable for diverse applications that demand consistent signal transmission.
6. Enhanced Design Flexibility:
Thanks to its low DK, the DiClad 880 PCB supports wider line widths, enabling lower insertion loss and improved design flexibility. Achieve optimal performance without compromising on your design requirements.
| Property | Test Method | Condition | DiClad 880 |
| Dielectric Constant @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.17, 2.20 |
| Dielectric Constant @ 1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.17, 2.20 |
| Dissipation Factor @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0009 |
| Dissipation Factor @ 1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 0.0008 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5
Adapted | -10°C to +140°C | -160 |
| Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.4 x 10 9 |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 2.9 x 10 6 |
| Arc Resistance | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 267, 202 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 8.1, 7.5 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 237 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 357 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Density (g/cm3) | ASTM D-792 Method A | A, 23°C | 2.23 |
| Water Absorption (%) | MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.02 |
| Coefficient of Thermal | IPC TM-650 2.4.24 | 0°C to 100°C | |
| Expansion (ppm/°C) | Mettler 3000 | |
| X Axis | Thermomechanical | 25 |
| Y Axis | Analyzer | 34 |
| Z Axis | | 252 |
| Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.261 |
| Outgassing | NASA SP-R-0022A | 125°C, ≤ 10-6 torr | |
| Total Mass Loss (%) | Maximum 1.00% | 0.01 |
| Collected Volatile | Maximum 0.10% | 0.01 |
| Condensable Material (%) | | |
| Water Vapor Regain (%) | | 0.01 |
| Visible Condensate (±) | | NO |
| Flammability UL File E 80166 | UL 94 Vertical Burn IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |
PCB Construction Details:
- 2-Layer Rigid PCB:
The construction of this PCB is a 2-layer rigid PCB, providing a sturdy foundation for your electronic designs.
- High-Quality Build:
With a copper layer of 35 μm on both the top and bottom sides and a DiClad 880 thickness of 0.762 mm (30 mil), this PCB ensures exceptional conductivity and durability.
- Precise Specifications:
The dimensions of this PCB measure 60 mm x 60 mm (+/- 0.15 mm), offering a compact yet versatile form factor. The minimum trace/space is 5/5 mils, while the minimum hole size is 0.35 mm. The finished board thickness is 0.8 mm, and the finished copper weight stands at 1 oz (1.4 mils) for the outer layers.
- Reliable Plating and Surface Finish:
This PCB features 20 μm via plating thickness to ensure robust connections. It also boasts an immersion silver surface finish, providing excellent conductivity and corrosion resistance.
- Rigorous Quality Assurance:
Prior to shipment, each PCB undergoes a 100% electrical test to ensure exceptional performance and reliability.
| PCB Material: | Woven Fiberglass Reinforced, PTFE-based Composites |
| Designation: | DiClad 880 |
| Dielectric constant: | 2.20 (10 GHz) |
| Dissipation factor | 0.0009 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold (ENIG), HASL, Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc.. |
Applications:
The DiClad 880 PCB is well-suited for a wide range of applications, including:
- Radar Feed Networks
- Commercial Phased Array Networks
- Low Loss Base Station Antennas
- Guidance Systems
- Digital Radio Antennas
- Filters, Couplers, LNAs
Supply and Standards:
DiClad 880 PCBs are available worldwide, allowing you to access this advanced technology regardless of your location. This PCB adheres to IPC-Class-2 standard, guaranteeing high-quality manufacturing and consistent performance.
Enhance your electronic designs to a whole new level with the DiClad 880 PCB, unlocking unrivaled performance, exceptional reliability, and unparalleled design flexibility. Embrace the future of PCB technology and experience the cutting-edge today.
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30mil DiClad 880 High Frequency PCB 2-layer Immesion Silver Images
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